Assessments - 3, GPA: 3.7
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In Push-Pull mode (selected by the SIP parameter SysPushPull asserted), ZN is tied to VCC_CORE with a resistor that has a resistance matching the impedance Z0 of the transmission line. ZP is tied to VSS with a resistor that has a resistance matching the impedance Z0 of the transmission line. Pin Descriptions Chapter 11 Preliminary Information 25175H—March 2003 AMD Athlon™ XP Processor Model 8 Data Sheet Ordering Information This section provides the ordering information for the AMD Athlon™ XP processor model 8. Standard AMD Athlon™ XP Processor Model 8 Products AMD standard products are available in several operating ranges. The ordering part numbers (OPN) are formed by a combination of the elements, as shown in Figure 18. OPN1 AXD A2700 DKV 3D Advanced Front-Side Bus (FSB): C = 266, D = 333 Size of L2 Cache: 3 = 256 Kbytes Die Temperature: T = 90°C, V = 85°C Operating Voltage: L = 1.50 V, U = 1.60 V, K =1.65 V Package Type: D = OPGA Model Number: 1600 operates at 1400 MHz2, 1700 at 1467 MHz2, 1800 at 1533 MHz2, 1900 at 1600 MHz2, 2000 at 1667 MHz2, 2100 at 1733 MHz2, 2200 at 1800 MHz2, 2400 at 2000 MHz2, 2600 at 2083 MHz3 or 2133 MHz2, 2700 at 2167 MHz3 Maximum Power: A = Desktop Processor Architecture Segment: AXD = AMD Athlon™ XP Processor Model 8 with QuantiSpeed™ Architecture for Desktop Products Notes: 1. Spaces are added to the number shown above for viewing clarity only. 2. This processor is available only with a 266 advanced FSB. 3. This processor is available only with a 333 advanced FSB. Figure 18. OPN Example for the AMD Athlon™ XP Processor Model 8 Chapter 12 Ordering Information Preliminary Information AMD Athlon™ XP Processor Model 8 Data Sheet 25175H—March 2003 Ordering Information Chapter 12 Pr PrPreliminary Information eliminary Informationeliminary Information 25175H—March 2003 AMD Athlon™ XP Processor Model 8 Data Sheet Appendix A Thermal Diode Calculations This section contains information about the calculations for the on-die thermal diode of the AMD Athlon™ XP processor model 8. For electrical information about this thermal diode, see Table 17, “Thermal Diode Electrical Characteristics,” on page 42. Ideal Diode Equation The ideal diode equation uses the variables and constants defined in Table 29. Table 29. Constants and Variables for the Ideal Diode Equation Equation Symbol Variable, Constant Description nf, lumped Lumped ideality factor k Boltzmann constant q Electron charge constant T Diode temperature (Kelvin) VBE Voltage from base to emitter IC Collector current IS Saturation current Appendix A - Thermal Diode Calculations Preliminary Information AMD Athlon™ XP Processor Model 8 Data Sheet 25175H—March 2003 Equation (1) shows the ideal diode calculation. k ICVBE = nflumped- ---T ----(1) , ...ln.. .. q IS Sourcing two currents and using Equation (1) derives the difference in the base-to-emitter voltage that leads to finding the diode temperature as shown in Equation (2). The use of dual sourcing currents allows the measurement of the thermal diode temperature to be more accurate and less susceptible to die and process revisions. Temperature sensors that utilize series resistance cancellation can use more than two sourcing currents and are suitable to be used with the AMD thermal diode. Equation (2) is the formula for calculating the temperature of a thermal diode. VBE high, – VBE low , T = -------------------------------------------------------------- -- k Ihigh (2) ln.. nf lumped.. , .. q Ilow Temperature Offset Correction A temperature offset may be required to correct the value measured by a temperature sensor. An offset is necessary if a difference exists between the lumped ideality factor of the processor and the ideality factor assumed by the temperature sensor. The lumped ideality factor can be calculated using the equations in this section to find the temperature offset that should be used with the temperature sensor. Table 30 shows the constants and variables used to calculate the temperature offset correction. Table 30. Constants and Variables Used in Temperature Offset Equations Equation Symbol nf, actual nf, lumped nf, TS Ihigh Ilow Tdie, spec Toffset Variable, Constant Description Actual ideality factor Lumped ideality factor Ideality factor assumed by temperature sensor High sourcing current Low sourcing current Die temperature specification Temperature offset 84 Appendix A - Thermal Diode Calculations 25175H—March 2003 Preliminary Information AMD Athlon™ XP Processor Model 8 Data Sheet The formulas in Equation (3) and Equation (4) can be used to calculate the temperature offset for temperature sensors that do not employ series resistance cancellation. The result is added to the value measured by the temperature sensor. Contact the vendor of the temperature sensor being used for the value of nf,TS. Refer to the document, On-Die Thermal Diode Characterization, order# 25443, for further details. Equation (3) shows the equation for calculating the lumped ideality factor...