Assessments - 1, GPA: 3
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Facilidade de uso
System Feature; 2. MCU Pin Assignment; 3. IGBT Feature; 4. Power Module; 5. IGBT Driver Module; 6. Pad Driver Module; 7. Main Board SCH; Folix 1.2 2010-9-10 Update operation description Terry Contents Revision History ................................................................................................................................... 1 1. Introduction........................................................................................................................................... 3 2. System Features .................................................................................................................................... 4 3. System Introduce .................................................................................................................................. 5 3.1. Hardware Block Diagram ............................................................................................................................................. 5 3.2. MCU Resource Usage .................................................................................................................................................. 5 3.3. MCU Pin Assignment ................................................................................................................................................... 6 3.4. IGBT Features .............................................................................................................................................................. 7 4. System Hardware .................................................................................................................................. 8 4.1. System Connect Diagram ........................................................................................................................................ 8 4.2. Front Board .............................................................................................................................................................. 9 4.3. Main Board ............................................................................................................................................................ 10 5. Module Description ............................................................................................................................ 11 5.1. Power Module ....................................................................................................................................................... 11 5.2. IGBT Driver Module ............................................................................................................................................. 11 5.3. Pad Driver Module ................................................................................................................................................ 12 6. System Operate ................................................................................................................................... 13 6.1. Key & Led Definition ............................................................................................................................................ 13 6.2. Operate Descript .................................................................................................................................................... 14 7. Debug and Programming .................................................................................................................... 15 7.1. Debug Environment and Tools .............................................................................................................................. 15 7.2. Hardware Setup ..................................................................................................................................................... 15 7.3. MCU Programming ............................................................................................................................................... 15 8. Appendix ............................................................................................................................................. 16 8.1. Front Board SCH and BOM-List ........................................................................................................................... 16 8.2. Main Board SCH and BOM-List ........................................................................................................................... 17 1. Introduction This document has introduced how to use the electromagnetic oven hardware. The hardware includes two PCB boards (main board and front board), a fan and a pad. 2. System Features . Power Control . Fan Control . Fan Delay Off . Buzz Control . Led Display . Keyboard . Kettle Detect . Kettle Empty Detect . Timing Power Off(3Hours) . Constant Power Heating . Constant Temperature Heating . IGBT Temp Detect . Plate Temp Detect . IGBT Temp Higher Protect(120.) . Plate Temp Higher Protect(300.) . Kettle Empty Pro...