Assessments - 4, GPA: 4
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Please follow these guidelines for all motherboard packaging with the AMD CrossFirechipset product line. Packaging Guidelines Mandatory Box Layout Requirements:There is only one mandatory element for all partner The AMD CrossFireChipset product logo MUST be on the front and back panels of the retail box.This elements must be reproduced without variation in the positions identified. Partner artwork can then be placed in grey zones of the marked illustration below. Packaging Guidelines Other Mandatory Requirements: 1. The proportion of logo size to package area shown must be maintained (see below) 2. To ensure sufficient visibility, an unobstructed Chipset badge logo. 3. The ™ should be placed after CrossFire. The must always appear at least once. 4. Pantone color 347 is always used for AMD green. Pantone color always used for CrossFirered. 5. Partners must include the legal line on all packaging or other advertising materials any AMD logos or visual “AMD, the AMD Arrow Radeon, and combinations thereof are trademarks Devices, Inc. Other for informational owners.” Packaging Guidelines Logo Sizing Requirements 1. Logo must be 0.375” away from box edge and other logos. 2. The logo must be at least 2” wide. 2” 0.375” Packaging Guidelines Incorrect Use of Chipset Package Art Template 1. The chipset badge logo is not placed on the front/top side of the packaging 2. The badge is two small, not meeting the 2” wide criteria 3. Partners may not add unauthorized numeric after the Chipset technology brand name. e.g. AMD 580X Pro Liteetc. 4. The Chipset badge cannot be place pack 2” ...
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