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Instruções de Operação Intel, Modelo Intel® Desktop Board DH67CF

Fabricante : Intel
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Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery. 1.10 Legacy I/O Controller The I/O controller provides the following features: • Consumer Infrared (CIR) headers • Serial IRQ interface compatible with serialized IRQ support for PCI systems • Intelligent power management, including a programmable wake-up event interface • PCI power management support The BIOS Setup program provides configuration options for the I/O controller. 1.10.1 Consumer Infrared (CIR) The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the supported operating systems. The CIR feature is made up of two separate pieces: the receiving (receiver) header, and the output (emitter) header. The receiving header consists of a filtered translated infrared input compliant with Microsoft CIR specifications, and also a “learning” infrared input. This learning input is simply a high pass input which the computer can use to “learn” to speak the infrared communication language of other user remotes. The emitter header consists of two output ports which the PC can use to emulate “learned” infrared commands in order to control external electronic hardware. Customers are required to buy or create their own interface modules to connect to Intel Desktop Boards for this feature to work. Product Description 1.11 Audio Subsystem The board supports Intel HD Audio via the Realtek ALC892 audio codec. The audio subsystem supports the following features: • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type. • A signal-to-noise (S/N) ratio of 97 dB • Microphone input that supports a single dynamic, condenser, or electret microphone • Windows Vista Ultimate and Windows 7 Ultimate certification Table 7 lists the supported functions of the front panel and back panel audio jacks. Table 7. Audio Jack Support Audio Jack Microphone Headphones Front Speaker Line In Rear Surround Center/ Sub Side Surround FP Green Default FP Pink Default Rear Blue Default Rear Green Ctrl panel Default Rear Pink Default Ctrl Panel Rear Black Default Rear Orange Default 1.11.1 Audio Subsystem Software The latest audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.3, page 16 1.11.2 Audio Subsystem Components The audio subsystem includes the following components: • Intel H67 Express Chipset • Realtek ALC892 audio codec • Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5pin header that provides mic in and line out signals for front panel audio connectors) (yellow) • S/PDIF digital audio out header (1 x 4-pin header) (yellow) • S/PDIF digital audio out connector on the back panel • 5-port analog audio input/output stack on the back panel Intel Desktop Board DH67CF Technical Product Specification The back panel audio connectors are configurable through the audio device drivers. The available configurable back panel audio connectors are shown in Figure 4. Item Description A Rear surround B Center channel and LFE (subwoofer) C S/PDIF out (optical) D Line in E Mic in/side surround F Line out/front speakers Figure 4. Back Panel Audio Connectors NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output. For information about Refer to The locations of the front panel audio header and S/PDIF audio header Figure 10, page 45 The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 47 The back panel audio connectors Section 2.2.1, page 44 Product Description 1.12 LAN Subsystem The LAN subsystem consists of the following: • Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s) • Intel H67 Express Chipset • RJ-45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include: • CSMA/CD protocol engine • LAN connect interface between the PCH and the LAN controller • PCI Conventional bus power management . ACPI technology support . LAN wake capabilities • LAN subsystem software For information about Refer to LAN software and drivers 1.12.1 Intel® 82579V Gigabit Ethernet Controller The Intel 82579V Gigabit Ethernet Controller supports the following features: • 10/100/1000 BASE-T IEEE 802.3 compliant • Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode] • Dual interconnect between the Integrated LAN Controller and the Physical Layer (PHY): . PCI Express-based interface for active state operation (S0) state . SMBUS for h...


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