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Tabla 3-1 Toxic and Hazardous Substances and Elements
Part Name
Lead
Mercury
Cadmium Hexavalent
Polybrom Polybrom
(Pb)
(Hg)
(Cd)
Chromium
i- nated
i- nated
(Cr(VI))
biphenyls diphenyl
(PBB)
ethers
(PBDE)
Motherboard, processor and heat sink
X
O
O
O
O
O
Memory
X
O
O
O
O
O
I/O PCAs
X
O
O
O
O
O
Power supply
X
O
O
O
O
O
Keyboard
X
O
O
O
O
O
Mouse
X
O
O
O
O
O
Chassis/Other
X
O
O
O
O
O
Fans
X
O
O
O
O
O
Internal/External Media Reading
X
O
O
O
O
O
Devices
External Control Devices
X
O
O
O
O
O
Cable/Other
X
O
O
O
O
O
HDD
X
O
O
O
O
O
O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for
this part is below the limit requirement in SJ/Txxxx-xxxx.
X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous
materials used for this part is above the limit requirement in SJ/Txxxx-xxxx.
All parts named in this table with an “X” are in compliance with the European Union's RoHS
Legislation – “Directive 2002/95/EC of the European Parliament and of the Council of 27 January
2003 on the restriction of the use of certain hazardous substances in electrical and electronic
equipment”.
NOTA: The referenced Environmental Protection Use Period Marking was determined according to
normal operating use conditions of the product such as temperature and humidity.
Restricción de Sustancias Peligrosas de Japón
(RoHS)
Un requisito normativo Japonés, definido por la especificación JIS C 0950, 2008, ordena que los
fabricantes suministren Declaraciones de Contenido de Material para ciertas categorías de productos
electrónicos que sean ofrecidos para venta a partir del 1º de julio de 2006.
Para visualizar la declaración de materiales JIS C 0950 para este producto, visite
http://www.hp.com/go/jisc0950.
ESMX
Restricción de Sustancias Peligrosas de Japón (RoHS)
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