Assessments - 3, GPA: 3.7
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Facilidade de uso
5 max. 700 TYP 100 TYP 0.4min. 1.0 TYP Pure green 4 2.05TYP 555 TYP 20 TYP 0.8min. 2.0 TYP Amber 40 80 15 2.7 max. 10 max. 590 TYP 30 TYP 0.4min. 1.0 TYP Orange(High brightness) 3 2.0 TYP 630 TYP 40 TYP 1.5min. 4.0 TYP Green(High brightness) 4 2.7 max. 2.05TYP 565 TYP 30 TYP 2.0min. 5.0 TYP TACT SwitchTM TACT SwitchTM Soldering Conditions Condition for Reflow Available for Surface Mount Type. 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2. CA(K)or CC(T)at solder joints(copper foil surface). A heat resistive tape Detector should be used to fix thermocouple. 3. Temperature profile Push Temperature (°C ) Slide Rotary 180 Encoders 150 Power Dual-in-line Package Type Multi Control Devices 260°C max. 3 sec max. 230°C Time120 sec max.( pre-heating ) 3 to 4min. Time inside soldering equipment 40s max. TACT SwitchTM Custom- Products Note 1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards and others. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Snap-in Type Surface Mount Type Radial Type Sharp Feeling Soft Feeling Conditions for Auto-dip Manual Soldering(Except SKRT series) Available for Snap-in Type and Radial Type (Except SKHJ, SKHL, SKQJ, SKQK, SKEG series) Items Condition Flux built-up Mounting surface should not be exposed to flax Preheating temperature Ambient temperature of the soldered surface of PC board. 100. max. Preheating time 60s max. Soldering temperature 260. max. Duration of immersion 5s max. Number of soldering 2times max. Items Condition Soldering temperature 350.max. Duration of soldering 3s max. Capacity of soldering iron 60W max. Notes 1. Consult with us for TACT SwitchTM washing conditions. 2. Prevent flux penetration from the top side of the TACT SwitchTM. 3. Switch terminals and a PC board should not be coated with flux prior to soldering. 4. The second soldering should be done after the switch returns to normal temperature. 5. Use the flux with a specific gravity of min 0.81. (EC-19S-8 by TAMURA Corporation, or equivalents.) TACT SwitchTM TACT SwitchTM Specification of Radial Taping Package Taping Packaging for Auto-insertion The SKQK, SKQN, SKRC, SKRG, SKPD and SKPL series are delivered with taping packaging. Box Size Detector ABC Push Slide Rotary Encoders Power Dual-in-line Package Type Multi Control Devices TACT SwitchTM Custom- Products Quantity Accommodated Per Box Series Qty/reel(pcs.) (Minimum packing unit) SKQK 1,000 SKPD 800 SKRG 2,000 SKQN SKRC 900 SKPL 2,700 Unit:mm Series SKQK SKPD SKQN 47331291SKRC 55337370SKPL SKRGAL to AS SKRGAA to AF 3343402354348A B C Sharp Feeling Soft Feeling Snap-in Type Surface Mount Typ...
Este manual também é adequado para os modelos :Equipamento de rede - SKPL Series (71.36 kb)