Assessments - 1, GPA: 4
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Facilidade de uso
5 1.1 Internal Functional Blocks .............................................................. 5 1.2 HDMP-3001 Features List ................................................................ 5 1.3 Applications ....................................................................................... 6 1.4 Benefits ............................................................................................... 6 1.5 Interfaces............................................................................................ 6 1.6 Data Processing ................................................................................. 6 2. Pinout ......................................................................................................... 7 2.1 Pin Assignments ................................................................................ 7 2.2 Pin Descriptions ................................................................................ 8 2.3 I/O Buffer Types .............................................................................. 16 3. Functional Description .......................................................................... 17 3.1 Introduction ..................................................................................... 17 3.2 Interface Descriptions .................................................................... 17 3.2.1 Microprocessor Interface ....................................................... 17 3.2.2 MII Management Interface .................................................... 17 3.2.3 EEPROM Interface .................................................................. 17 3.2.4 MII Interface ............................................................................. 17 3.2.5 SONET/SDH Interface............................................................. 18 3.3 Initialization ..................................................................................... 18 3.3.1 Hardware reset ......................................................................... 18 3.3.2 Software Reset ......................................................................... 18 3.3.3 Software State Machine Reset ............................................... 18 3.4 Bit Order ........................................................................................... 18 3.4.1 GFP Mode ................................................................................. 18 3.4.2 LAPS Mode ............................................................................... 19 3.5 Performance Monitoring ................................................................ 19 3.6 Test .................................................................................................... 20 3.6.1 Loopbacks ................................................................................. 20 3.6.2 JTAG .......................................................................................... 21 3.7 Interrupts.......................................................................................... 21 3.7.1 Interrupt Driven Mode ........................................................... 21 3.7.2 Polled Mode .............................................................................. 21 3.7.3 Interrupt Sources ..................................................................... 21 3.7.4 APS_INTB ................................................................................. 22 3.8 Data Processing ............................................................................... 22 3.8.1 LAPS Processing ...................................................................... 22 3.8.2 GFP Processing ........................................................................ 23 3.9 SONET/SDH Processing................................................................. 24 3.9.1 Transmit SONET/SDH Processing Overview ...................... 24 3.9.2 Receive SONET/SDH Processing Overview ........................ 25 3.9.3 Transmit SONET/SDH Processing Details ........................... 25 3.9.4 Receive SONET/SDH Processing Details ............................. 30 4. Application Information ........................................................................ 38 4.1 Chip setup and configuration ........................................................ 38 4.1.1 EEPROM Detection ................................................................. 38 4.2 Configurations ................................................................................. 38 4.2.1 PHY and MAC mode ................................................................ 38 4.2.2 SDH and SONET mode ........................................................... 38 4.2.3 LAPS and GFP mode ............................................................... 38 4.2.4 INT Pin Configuration ............................................................. 38 4.3 Firmware and System Design Information ................................. 40 4.3.1 Board level pull-ups and pull-downs..............